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From: "Spehro Pefhany"
Subject: Re: Protection of a design?
User-Agent: tin/pre-1.4-19990216 ("Styrofoam") (UNIX) (Linux/2.2.14 (i586))
Date: Fri, 04 Oct 2002 21:30:41 GMT
NNTP-Posting-Date: Fri, 04 Oct 2002 17:30:41 EDT
The renowned Erik wrote:
> One of our competitors has cloned our product. The OTP-PIC has be read
> out although it was protected. Now I want to protect our new design.
> What can I do?
Not much, all protection technologies can be broken if the competitor has
enough money to spend. If you can prove that your code was stolen you
could take legal action against the competitor under copyright laws. If
they just reverse engineered the functionality then you are probaby SOL.
> What technology is being used with the DIE-chips? Can it be mounted
> directly onto the print? What are the costs? What are the benefits and
> what are the disadvantages? It's this process expensive (for 10kpcs)?
COB packaging wouldn't add much to your security, IMO, and might cause
other problems (low yield, reduced flexibility, increased PCB cost). It's
easy enough to decapsulate the chip-- wouldn't add significantly to
the cost of stealing your code. Do you mean runs of 10K? 10K per month?
10K per year? 10K total production? It's most suitable when there is
little else of value on the board besides the uP, and it's far more common
"it's the network..." "The Journey is the reward"
email@example.com Info for manufacturers: http://www.trexon.com
Embedded software/hardware/analog Info for designers: http://www.speff.com
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