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From: James Meyer
Subject: Re: Thermal effects of potting compound?
X-Newsreader: Forte Agent 1.91/32.564
Date: Wed, 16 Oct 2002 22:49:59 GMT
NNTP-Posting-Date: Wed, 16 Oct 2002 18:49:59 EDT
On Wed, 16 Oct 2002 07:01:21 -0400, "Ge0"
>I have a circuit with surface mount power electronics on it (DPAK MOSFET,
>A.) turning the circuit upside down affect its thermal performance? Heat
>will rise into FR-4 instead of air.
Surface mount parts are already so well thermally connected to the board
that there would be no extra heat transmission to the board from hot air
surrounding the parts.
>B.) Encapsulating the whole thing in a 5mm layer (eah side) of potting
>compound affect its thermal performance?
The effect of encapsulation would be minimal.
>Is there a certain de-rating I need to do in each instance?
>Are there various grades of potting compound that will actually help conduct
>heat rather than be an insulator?
Yes. But then the question is, conduct the heat to where? Conduct to
the air? Potting won't change the conduction to air. Conducting heat with
potting material filling the gap between the board and something else is a
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