The Cyber-Spy.Com Usenet Archive Feeds Directly
From The Open And Publicly Available Newsgroup
This Group And Thousands Of Others Are Available
On Most IS NNTP News Servers On Port 119.
Cyber-Spy.Com Is NOT Responsible For Any Topic,
Opinions Or Content Posted To This Or Any Other
Newsgroup. This Web Archive Of The Newsgroup And
Posts Are For Informational Purposes Only.
From: "Phil Allison"
References: <email@example.com> <3DCF50E9.CF58D143@rica.net> <3DCF5916.50B32FE1@rica.net>
Subject: Re: Question about linear derating factor for MOSFETs
X-Newsreader: Microsoft Outlook Express 5.50.4522.1200
Date: Mon, 11 Nov 2002 18:26:14 +1100
NNTP-Posting-Date: Mon, 11 Nov 2002 18:16:27 EST
Organization: Telstra BigPond Internet Services (http://www.bigpond.com)
"John Popelish" wrote in message
> Phil Allison wrote:
> > "John Popelish" wrote in message
> > news:3DCF50E9.CF58D143@rica.net...
> > >
> > > Perhaps you could submerge the device in alcohol or freon in a large
> > > chamber with all the air evacuated, so that all the space was filled
> > > with saturated vapor. This can act as a heat sink over the whole
> > > surface of the device with a thermal conductivity a few hundred times
> > > higher than solid copper.
> > ** I was pondering a source of chilled liquid mercury ( abound 0
> > degrees C ) flowing across the undersurface in a laminar high velocity
> > stream (like a solder flow bath) and then fed to a resevoir of solid
> > What da ya reckon - a cool idea ?
> Phase change is much better at carrying heat away than liquid flow.
** But the phase change has to be happening at no more than 25 to 50
degrees on the device surface for that to work - right ? The liquid would
have to be constantly replaced as it evaporates too so the whole device
surface was wetted.
Go Back To The Cyber-Spy.Com
Usenet Web Archive Index Of
The sci.electronics.design Newsgroup