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From: "Phil Allison"
References: <firstname.lastname@example.org> <3DCF50E9.CF58D143@rica.net> <3DCF5916.50B32FE1@rica.net>
Subject: Re: Question about linear derating factor for MOSFETs
X-Newsreader: Microsoft Outlook Express 5.50.4522.1200
Date: Mon, 11 Nov 2002 18:26:14 +1100
NNTP-Posting-Date: Mon, 11 Nov 2002 18:16:27 EST
Organization: Telstra BigPond Internet Services (http://www.bigpond.com)
"John Popelish" wrote in message
> Phil Allison wrote:
> > "John Popelish" wrote in message
> > news:3DCF50E9.CF58D143@rica.net...
> > >
> > > Perhaps you could submerge the device in alcohol or freon in a large
> > > chamber with all the air evacuated, so that all the space was filled
> > > with saturated vapor. This can act as a heat sink over the whole
> > > surface of the device with a thermal conductivity a few hundred times
> > > higher than solid copper.
> > ** I was pondering a source of chilled liquid mercury ( abound 0
> > degrees C ) flowing across the undersurface in a laminar high velocity
> > stream (like a solder flow bath) and then fed to a resevoir of solid
> > What da ya reckon - a cool idea ?
> Phase change is much better at carrying heat away than liquid flow.
** But the phase change has to be happening at no more than 25 to 50
degrees on the device surface for that to work - right ? The liquid would
have to be constantly replaced as it evaporates too so the whole device
surface was wetted.
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