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From: Winfield Hill
Subject: Re: Thermal resistance of DIP-8
Date: 16 Nov 2002 09:24:37 -0800
Organization: Rowland Institute
X-Newsreader: Direct Read News 4.10
>> Does anybody know the value of the DIP-8 package
>> junction-to-case thermal resistance?
> I ask because I have not found it in the datasheet.
> There is only junction-2-ambient resistance.
Linear Technology says,
qJA = 80°C/W TO 120°C/W DEPENDING ON PC BOARD LAYOUT
Given all the uncertainties of the "case" to ambient thermal
resistance for a miniDIP, a junction-to-ambient spec seems wise.
But NSC gives a spec (in their LM380 2.5W amplifier datasheet),
Package Dissipation 8-Pin DIP (Note 7) 1.67W
qJC (8-Pin DIP) 37°C/W
qJA (8-Pin DIP) 107°C/W
Note 7: The package is to be derated at 75°C/W junction to
heat sink pins for 8-pin pkg. (They suggest copper areas on
the pcb and/or soldered copper heat-sink fins to get as low
as 35°C/W overall.)
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