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From: "Sir Charles W. Shults III"
Subject: Re: Ultrasonic heating?
X-Newsreader: Microsoft Outlook Express 6.00.2600.0000
Date: Mon, 09 Dec 2002 04:13:56 GMT
NNTP-Posting-Date: Sun, 08 Dec 2002 23:13:56 EST
Organization: RoadRunner - Central Florida
A number of wire bonders used a hollow tip that fed the gold bond wire
through itself without a flame or other source of heat, but these are not ball
bonding machines. The tip is driven with a high powered ultrasonic source,
making the tip (which was piezo driven) oscillate and attach the wire through
frictional heating. This resulted in a very small, localized heating effect
that would influence the bond only.
Ball bonding machines also feed the wire through a hollow tip (usually) and
have a tiny flame that melts the wire end into a bead. This molten bead is then
bonded to the die. The flame is typically hydrogen because it was very clean
and produced a very high temperature.
I have not heard of an ultrasonic ball bonding machine, even though I once
serviced many devices used in the fabrication of wafers and packaged chips.
My robotics, space and CGI web page - http://home.cfl.rr.com/aichip
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