Subject: Re: Reducing contact resistance for low volt use?
Summary: What do you think of these ping times eh?
Reply-To: You can't see me, and I pass right through planets...
References: <firstname.lastname@example.org> <email@example.com> <firstname.lastname@example.org> <email@example.com> <firstname.lastname@example.org> <email@example.com>
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Date: Mon, 13 Jan 2003 15:18:10 GMT
NNTP-Posting-Date: Mon, 13 Jan 2003 10:18:10 EST
On Wed, 08 Jan 2003 14:29:19 GMT, firstname.lastname@example.org (John Fields) Gave
>You know not of what you speak. From one of your other posts you
>indicated that it was your belief that a paucity of plating would
>result in gaseous oxygen intrusion and corrosion when, in fact, a
>humid environment would be all that what was required to allow the
>galvanic corrosion to occur since, with the intrusion of a water
>molecule into the Cu Ag electrolytic cell, it becomes dissociated
>and starts tearing shit up.
You obviously have yet to read the mil spec on the issue.
The oxidation/corrosion does not even occur on heavier plated
samples. Only where the plating is thin enough to appear "porous" as
it relates to allowing OXYGEN into the INTERFACE between the two