NNTP-Posting-Date: Mon, 13 Jan 2003 11:12:27 -0600
From: email@example.com (John Fields)
Subject: Re: Reducing contact resistance for low volt use?
Date: Mon, 13 Jan 2003 15:58:29 GMT
Organization: Austin Instruments, Inc.
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On Mon, 13 Jan 2003 15:18:10 GMT, DarkMatter
>On Wed, 08 Jan 2003 14:29:19 GMT, firstname.lastname@example.org (John Fields) Gave
>>You know not of what you speak. From one of your other posts you
>>indicated that it was your belief that a paucity of plating would
>>result in gaseous oxygen intrusion and corrosion when, in fact, a
>>humid environment would be all that what was required to allow the
>>galvanic corrosion to occur since, with the intrusion of a water
>>molecule into the Cu Ag electrolytic cell, it becomes dissociated
>>and starts tearing shit up.
> You obviously have yet to read the mil spec on the issue.
> The oxidation/corrosion does not even occur on heavier plated
>samples. Only where the plating is thin enough to appear "porous" as
>it relates to allowing OXYGEN into the INTERFACE between the two
_Galvanic_ corrosion requires the presence of an electrolyte. In
this case, non-deionized water as is found in nature. A porous
silver coating over copper will allow this electrolyte (impure
atmospheric water vapor) to contact the two dissimilar metals, which
are in electrical contact, and a current will flow between them
which will change the chemical structure of the materials comprising
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