Subject: Re: Reducing contact resistance for low volt use?
Summary: What do you think of these ping times eh?
Reply-To: You can't see me, and I pass right through planets...
References: <firstname.lastname@example.org> <email@example.com> <firstname.lastname@example.org> <email@example.com> <firstname.lastname@example.org> <email@example.com> <firstname.lastname@example.org>
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Date: Tue, 14 Jan 2003 15:58:22 GMT
NNTP-Posting-Date: Tue, 14 Jan 2003 10:58:22 EST
On Mon, 13 Jan 2003 15:58:29 GMT, email@example.com (John Fields) Gave
>On Mon, 13 Jan 2003 15:18:10 GMT, DarkMatter
>>On Wed, 08 Jan 2003 14:29:19 GMT, firstname.lastname@example.org (John Fields) Gave
>>>You know not of what you speak. From one of your other posts you
>>>indicated that it was your belief that a paucity of plating would
>>>result in gaseous oxygen intrusion and corrosion when, in fact, a
>>>humid environment would be all that what was required to allow the
>>>galvanic corrosion to occur since, with the intrusion of a water
>>>molecule into the Cu Ag electrolytic cell, it becomes dissociated
>>>and starts tearing shit up.
>> You obviously have yet to read the mil spec on the issue.
>> The oxidation/corrosion does not even occur on heavier plated
>>samples. Only where the plating is thin enough to appear "porous" as
>>it relates to allowing OXYGEN into the INTERFACE between the two
>_Galvanic_ corrosion requires the presence of an electrolyte. In
>this case, non-deionized water as is found in nature. A porous
>silver coating over copper will allow this electrolyte (impure
>atmospheric water vapor) to contact the two dissimilar metals, which
>are in electrical contact, and a current will flow between them
>which will change the chemical structure of the materials comprising
Except that the discussion was about red plague corrosion in SPC
conductors. Which is based on the presence of OXYGEN at the metal
interface, not water.