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NNTP-Posting-Date: Thu, 16 Jan 2003 08:07:54 -0600
From: email@example.com (John Fields)
Subject: Re: Reducing contact resistance for low volt use?
Date: Thu, 16 Jan 2003 13:41:49 GMT
Organization: Austin Instruments, Inc.
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On Thu, 16 Jan 2003 01:35:52 GMT, DarkMatter
> Considering, you dipshit, that the mil boys are those that
>determined that low plating thickness was a problem to begin with, I
>would say that it is you that the clueless one here.
_You_ would say? What makes you think that all of a sudden your
idiotic opinions matter?
No one ever said it _wasn't_ thin plating that was the problem, the
bone of contention is what the chemistry is that's causing the
corrosion. I say that since it's galvanic corrosion moisture is
required, and you're such an ignorant cocksucker you don't even know
what "galvanic" means. Go look it up if you know how.
Have you ever heard of a copper-silver-air battery? No. Here; I've
got an experiment you can perform if you can follow a few simple
1. Get yourself a piece of silver-plated copper wire.
2. Scrape through the plating until you can see the copper.
3. Get yourself a jar you can seal which is large enough to hold the
4. Place the wire sample in the jar along with a desiccant, fill the
jar with oxygen (You can make some oxygen by electrolyzing some
water, but you'll need to dry it before you use it, so run it
through a desiccant before you fill the jar with it.
5. Seal the jar.
6. Keep a sharp eye on the jar and post back here the moment you see
any red plague.
> Oxygen is all that is required.
Prove it. Do the experiment.
> Hahahaha... I am doing just fine. You are the loser.
> You are the goddamned retard.
Yeah, you're doing just fine... A know-nothing wannabe tech with an
attitude hanging on to one last straw for dear life while at the
same time displaying his abyssmal ignorance in public.
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