Subject: Re: Prototyping with Chip-on-board
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Date: Tue, 21 Jan 2003 07:36:29 GMT
NNTP-Posting-Date: Tue, 21 Jan 2003 02:36:29 EST
Organization: Cox Communications
Which RF devices?
Non-capsulated chips (die-only) are 10-50% cheaper than
"normal" (encapsulated) ones, depends of quantity. Engineering samples
quantity for die-form ranges from 50-100 peaces, MOQ (minimal order
quantity) for production are 1K-10K, depends of type of chips as well as who
is gonna handle the production. Typical example is: "Normal" 24LC64 8Kbyte
EEPROMs are $1-$2 (depends of quantity, roughly 1K peaces), die-form 24LC64
are around 70 cents (10K MOQ). Far-East market (i.e. Hong-Kong) may be a bit
cheaper, no more than 10%.
Your quastion involves a lot of variables, mostly who, where and when buys
the die-form chips.
BTW: Today's encapsulated forms, especially BGA and PBGA may be even chepaer
than die-form, because in order to get the die-form somebody has to actually
take the dies from the production line and fully test them in compliance
with standards before they (die-chips) are placed into standardized
packaging, which takes time and therefore money.
The biggest and heaviest variable in the game is. as always, the MOQ.
"Peter Frasier" wrote in message
> Hi. I have a project to prototype on. A microcontroller and a couple
> of RTF devices. I am wandering what would be a realistic cost for
> having it done with COB technology.
> Any help would be very much appreciated