From: firstname.lastname@example.org (Peter Frasier)
Subject: Re: Prototyping with Chip-on-board
Date: 21 Jan 2003 18:20:07 -0800
NNTP-Posting-Date: 22 Jan 2003 02:20:07 GMT
"DG_1" wrote in message news:<1M6X9.20241$FY4.email@example.com>...
> Which microcontroller?
> Which RF devices?
> Non-capsulated chips (die-only) are 10-50% cheaper than
> "normal" (encapsulated) ones, depends of quantity. Engineering samples
> quantity for die-form ranges from 50-100 peaces, MOQ (minimal order
> quantity) for production are 1K-10K, depends of type of chips as well as who
> is gonna handle the production. Typical example is: "Normal" 24LC64 8Kbyte
> EEPROMs are $1-$2 (depends of quantity, roughly 1K peaces), die-form 24LC64
> are around 70 cents (10K MOQ). Far-East market (i.e. Hong-Kong) may be a bit
> cheaper, no more than 10%.
> Your quastion involves a lot of variables, mostly who, where and when buys
> the die-form chips.
> BTW: Today's encapsulated forms, especially BGA and PBGA may be even chepaer
> than die-form, because in order to get the die-form somebody has to actually
> take the dies from the production line and fully test them in compliance
> with standards before they (die-chips) are placed into standardized
> packaging, which takes time and therefore money.
> The biggest and heaviest variable in the game is. as always, the MOQ.
How about the cost of actually making the prototype, that is to place
the die-forms on the PCB and solder them.
> "Peter Frasier" wrote in message
> > Hi. I have a project to prototype on. A microcontroller and a couple
> > of RTF devices. I am wandering what would be a realistic cost for
> > having it done with COB technology.
> > Any help would be very much appreciated
> > Peter